Active Components is pleased to partner with T-Global Technology to bring reliable thermal management solutions to customers across New Zealand and Australia.
In this blog, we feature T-Global’s latest thermal pad solutions, including the AD Series Ultra Soft Thermal Pad and the L Series Low Bleed Thermal Pad. Designed for demanding electronic applications, these thermal pads offer strong thermal performance, excellent compressibility, and reliable stability across a wide range of environments.
What Is a Thermal Pad?
A thermal pad is a thermal interface material designed to transfer heat between electronic components and heat sinks or metal surfaces. By filling small air gaps between surfaces, thermal pads help improve thermal contact and heat transfer efficiency within electronic systems.
Image source: T-Global
Thermal pads are widely used in electronic applications where reliable heat dissipation, electrical insulation, and ease of installation are important. Depending on the application requirements, different thermal pad materials can offer characteristics such as high thermal conductivity, compressibility, softness, low bleed performance, and self-adhesive properties.
Why Thermal Pads Matter
Compared with some other thermal interface materials, thermal pads can offer more consistent installation and long-term stability across different operating environments. They are commonly used in applications where durability, reliability, and reduced maintenance are important, including industrial electronics, LED systems, automotive electronics, power modules, and PCB assemblies.
Thermal pads can also simplify assembly processes thanks to their ease of handling and controlled thickness, making them suitable for applications requiring consistent thermal performance across large-scale production.
AD Series Ultra Soft Thermal Pads
The ultra-soft material structure of the AD Series Thermal Pads from T-Global is designed to improve contact between components and cooling surfaces, supporting more efficient heat transfer across uneven or sensitive assemblies.
With only light pressure required to achieve a close fit, the material can effectively fill gaps between electronic components and heat sinks. This helps reduce thermal resistance and improve overall heat dissipation performance.
- High thermal conductivity
- Low thermal impedance
- Excellent electrical insulation
- Ultra-soft material with excellent compressibility
Applications
5G, aerospace, AI, AIoT, AR/VR/MR/XR, automotive, consumer electronics, datacom, electric vehicles, energy storage, industrial equipment, lighting, medical devices, military applications, netcom, power electronics, robotics, servers, smart home systems, telecommunications, and more.
TG-AD75 Thermal Pad
Specifically developed for network communications, cloud computing, and servers, the TG-AD75 offers outstanding thermal conductivity of 7.5 W/m·K and features an ultra-soft Shore OO 25 texture.
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TG-AD66 Thermal Pad
Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, the TG-AD66 Ultra Soft Thermal Pad offers outstanding thermal conductivity of 6.5 W/m·K and features an ultra-soft Shore OO 25 texture.
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TG-AD30 Thermal Pad
Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, these new products offer outstanding thermal conductivity (3.0 W/m·K) and achieve an ultra-soft texture with a Shore OO hardness of 20.
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L Series Low Bleed Thermal Pads
The L Series Low Bleed Thermal Pads from T-Global is designed for applications requiring stable thermal performance and improved long-term material reliability. The L Series helps reduce material migration over time, supporting cleaner operation around sensitive electronic components. Key features include:
- Low bleed
- •High compressibility
- Self-adhesive
- High thermal conductivity
Applications：
5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
TG-A5000L Low Oil Bleed Thermal Pad
The TG-A5000L boasts a high thermal conductivity of 5.0 W/m·K and is engineered to meet the demands of high-performance computing. With advanced low-bleed technology and excellent heat resistance, this material helps devices maintain stability and reliability at high temperatures, even during extended periods of operation.
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TG-A3200L Low Oil Bleed Thermal Pad
The TG-A3200L features low oil bleed and excellent electrical insulation, making it suitable for a wide range of electronic applications. It helps maintain device stability while providing efficient heat dissipation, enabling electronic components to operate at optimal temperatures and maintain high performance during extended periods of use.
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TG-A1800L Low Oil Bleed Thermal Pad
The TG-A1800L is a low oil bleed thermal pad designed to effectively minimise silicone oil migration, helping improve the stability and durability of electronic products.
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Effective Thermal Management Starts with the Right Solution
Effective thermal management is not just about selecting individual components. Different applications often come with unique thermal, mechanical, and sourcing requirements, especially in complex electronic designs and long-term production environments.
Partnering with trusted global manufacturers such as T-Global Technology, Active Components supports customers with thermal management solutions tailored to different project requirements. Alongside thermal pads, we can also assist with sourcing related thermal management components, including cooling fans, heat sinks, thermal paste, and other supporting solutions.
Image source: T-Global
How Active Components Supports Your Thermal Management Projects
Our team works closely with customers to identify suitable component options, coordinate with multiple suppliers as needed, and support long-term cost efficiency and supply flexibility throughout the project lifecycle.
Rather than simply supplying parts, we focus on helping customers find practical, reliable thermal management solutions that meet their design and operational requirements.
Our Support Includes:
- Thermal management component sourcing: Cooling fans, heat sinks, thermal paste, thermal pads, and more.
- Alternative component solutions and solution support.
- Multi-supplier coordination.
- Long-term cost efficiency support.
- Assistance with mechanical and thermal application requirements.
If you would like to discuss your project or explore suitable thermal management solutions for your application, our team is happy to assist.
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